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Anzahl der Publikationen: 2
Zeitschriftenartikel
Nistor, Nicolae 
ORCID: https://orcid.org/0000-0002-9956-1670; Stanciu, Dorin; Lerche, Thomas und Kiel, Ewald
(September 2019):
“I am fine with any technology, as long as it doesn’t make trouble, so that I can concentrate on my study”. A case study of university students’ attitude strength related to educational technology acceptance.
In: British Journal of Educational Technology, Bd. 50, Nr. 5: S. 2557-2571
ORCID: https://orcid.org/0000-0002-9956-1670; Stanciu, Dorin; Lerche, Thomas und Kiel, Ewald
(September 2019):
“I am fine with any technology, as long as it doesn’t make trouble, so that I can concentrate on my study”. A case study of university students’ attitude strength related to educational technology acceptance.
In: British Journal of Educational Technology, Bd. 50, Nr. 5: S. 2557-2571
Konferenzbeitrag
Jiang, Siyu ORCID: https://orcid.org/0000-0001-9826-0449; Nistor, Nicolae ORCID: https://orcid.org/0000-0002-9956-1670 und Stanciu, Dorin ORCID: https://orcid.org/0000-0002-7343-1667
(2023):
Higher Education from a Learning Analytics Perspective: an Exploration of the Theory Choice in Doctoral Educational Research.
TEEM 2022: Tenth International Conference on Technological Ecosystems for Enhancing Multiculturality, Salamanca, Spain, October 19–21, 2022.
García-Peñalvo, Francisco José und García-Holgado, Alicia (Hrsg.):
In: Proceedings TEEM 2022: Tenth International Conference on Technological Ecosystems for Enhancing Multiculturality,
S. 1190-1198
ORCID: https://orcid.org/0000-0001-9826-0449; Nistor, Nicolae ORCID: https://orcid.org/0000-0002-9956-1670 und Stanciu, Dorin ORCID: https://orcid.org/0000-0002-7343-1667
(2023):
Higher Education from a Learning Analytics Perspective: an Exploration of the Theory Choice in Doctoral Educational Research.
TEEM 2022: Tenth International Conference on Technological Ecosystems for Enhancing Multiculturality, Salamanca, Spain, October 19–21, 2022.
García-Peñalvo, Francisco José und García-Holgado, Alicia (Hrsg.):
In: Proceedings TEEM 2022: Tenth International Conference on Technological Ecosystems for Enhancing Multiculturality,
S. 1190-1198