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Anzahl der Publikationen: 3
Zeitschriftenartikel
Sanakoyeu, Artsiom; Ma, Pingchuan; Tschernezki, Vadim und Ommer, Björn 
ORCID: https://orcid.org/0000-0003-0766-120X
(2021):
Improving Deep Metric Learning by Divide and Conquer.
In: IEEE Transactions on Pattern Analysis and Machine Intelligence, Bd. 44, Nr. 11: S. 8306-8320
ORCID: https://orcid.org/0000-0003-0766-120X
(2021):
Improving Deep Metric Learning by Divide and Conquer.
In: IEEE Transactions on Pattern Analysis and Machine Intelligence, Bd. 44, Nr. 11: S. 8306-8320
Konferenzbeitrag
Kotovenko, Dmytro; Ma, Pingchuan; Milbich, Timo und Ommer, Björn ORCID: https://orcid.org/0000-0003-0766-120X
(2023):
Cross-Image-Attention for Conditional Embeddings in Deep Metric Learning.
2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Vancouver, BC, Canada, 17-24 June 2023.
In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
New York: IEEE. S. 11070-11081
ORCID: https://orcid.org/0000-0003-0766-120X
(2023):
Cross-Image-Attention for Conditional Embeddings in Deep Metric Learning.
2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Vancouver, BC, Canada, 17-24 June 2023.
In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
New York: IEEE. S. 11070-11081
Kotovenko, Dmytro; Sanakoyeu, Artsiom; Ma, Pingchuan; Lang, Sabine und Ommer, Björn ORCID: https://orcid.org/0000-0003-0766-120X
(2019):
A Content Transformation Block for Image Style Transfer.
2019 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Long Beach, CA, USA, 15-20 June 2019.
In: 2019 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
New York: IEEE. S. 10024-10033
ORCID: https://orcid.org/0000-0003-0766-120X
(2019):
A Content Transformation Block for Image Style Transfer.
2019 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR), Long Beach, CA, USA, 15-20 June 2019.
In: 2019 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
New York: IEEE. S. 10024-10033