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Gruppiert nach: Dokumententyp | Veröffentlichungsdatum
Anzahl der Publikationen: 4

Zeitschriftenartikel

Chiossi, Francesco ORCID logoORCID: https://orcid.org/0000-0003-2987-7634; Ou, Changkun ORCID logoORCID: https://orcid.org/0000-0002-4595-7485; Gerhardt, Carolina; Putze, Felix ORCID logoORCID: https://orcid.org/0000-0001-5203-8797 und Mayer, Sven ORCID logoORCID: https://orcid.org/0000-0001-5462-8782 (Februar 2025): Designing and Evaluating an Adaptive Virtual Reality System using EEG Frequencies to Balance Internal and External Attention States. In: International Journal of Human-Computer Studies, Bd. 196, 103433 [PDF, 2MB]

Hollaender, Kai; Ou, Changkun; Schellenberg, Luca und Butz, Andreas (2020): All Fun and Games: Obtaining Critical Pedestrian Behavior Data from an Online Simulation. In: Chi'20: Extended Abstracts of the 2020 Chi Conference on Human Factors in Computing Systems, LBW091

Konferenzbeitrag

Chiossi, Francesco ORCID logoORCID: https://orcid.org/0000-0003-2987-7634; Haliburton, Luke ORCID logoORCID: https://orcid.org/0000-0002-5654-2453; Ou, Changkun ORCID logoORCID: https://orcid.org/0000-0002-4595-7485; Butz, Andreas Martin ORCID logoORCID: https://orcid.org/0000-0002-9007-9888 und Schmidt, Albrecht ORCID logoORCID: https://orcid.org/0000-0003-3890-1990 (2023): Short-Form Videos Degrade Our Capacity to Retain Intentions. Effect of Context Switching On Prospective Memory. CHI conference on Human Factors in Computing Systems (CHI), Hamburg, Germany, 23. - 28. April 2023. Schmidt, Albrecht (Hrsg.): In: Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems, 30 New York: Association for Computing Machinery.

Li, Yanhong; Harmat, Enikö; Mayer, Maximilian und Ou, Changkun (2022): Examining Actual Effects of a Tangible Tool on Children's Collaboration. IEEE International Symposium on Mixed and Augmented Reality Adjunct (ISMAR-Adjunct), Singapore, Singapore, 17-21 October 2022. In: 2022 IEEE International Symposium on Mixed and Augmented Reality Adjunct (ISMAR-Adjunct), Piscataway, NJ, USA: IEEE. S. 582-587

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